New Step by Step Map For Noohapou
New Step by Step Map For Noohapou
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distant spots: Static models are usually situated remotely, expanding Value and lowering General program effectiveness.
Instrument & TCU program calibration strategies change exterior test products not made use of frequently for verifying
Together with the POU3500, you could realize unparalleled leads to etch performance, chamber uptime, decreased price of ownership and fab Place utilization – all even though improving upon your procedure trustworthiness.
Originally Started in 1985, our organization has grown right into a identified leader in providing temperature control techniques to the worldwide semiconductor field.
This exceptional technique, providing a little kind factor, affordable-of-Ownership and Dynamic Temperature Control offered method and products engineers a completely new Software to improve their temperature delicate procedures.
The accuracy of the POU 3300 allows for impartial control of the procedure fluid temperature towards the wafer chuck inside +/- 0.one °C of established point, along with the fast reaction time of your process makes it possible for for maximum wafer-to-wafer repeatability throughout the etch course of action.
All static TCUs involve excessive cooling & heating capacities because of their pretty massive system fluid reservoirs. the procedure fuid reservoir on LAUDA-Noah's dynamic temperature Command technique is lower than 1 gallon.
Together with the POU3300, you could attain unprecedented results in etch overall performance, chamber uptime, lessened cost of possession and fab space utilization – all although enhancing your process reliability.
The data pertains to your 300mm chamber temperature profile all through a large element ratio Etch process, operating at incredibly high RF ability ailments (~3.8kW). The compelling components of this knowledge set are:
Dynamic Temperature Command, as applied in units such as LAUDA-Noah POU, is undoubtedly an solution that senses the temperature of the procedure fluid getting back from the here method chamber’s wafer chuck (ESC) and dynamically adjusts the temperature of your equipped course of action fluid according to this true-time feedback.
The TEs' can swap directly from heating to cooling, or visa-versa. they will activate & off whilst while in the heating or cooling method and might maximize or decrease the quantity of heating or cooling with out switching in any respect.
The POU3300 method presents dynamic temperature control of the procedure chamber cathode / electrode / anode and might be synchronized with any etch system.
The reality is genuine Dynamic Temperature Manage can only be obtained when all 5 (5) of the next procedure structure and set up necessities are fulfilled:
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We demand significantly less cooling/heating capacity for the same application being a static TCU on account of our tiny reservoir quantity.
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